Shenzhen oke didara aluminiomu PCB MCPCB pẹlu Taiyo PSR-4000 jara funfun solder boju
Agbara iṣelọpọ:
ohun kan | Agbara iṣelọpọ |
Ohun elo | FR4, CEM-1, Aluminiomu, Poly amide |
Layer No. | 1-12 |
Pari ọkọ sisanra | 0.1 mm-4.0mm |
Ifarada Ọkọ Sisanra | ± 10% |
Cooper sisanra | 0.5 OZ-3OZ (18 um-385 um) |
Ejò Plating Iho | 18-40 iwon |
Impedance Iṣakoso | ± 10% |
Warp&Twist | 0.70% |
Peeli le | 0.012"(0.3mm) -0.02'(0.5mm) |
Awọn aworan
Iwọn Iwa Kakiri Min (a) | 0.075mm (milionu 3) |
Ìbú Ààyè Kekere (b) | 0.1mm (4 mil) |
Min Annuular Oruka | 0.1mm (4 mil) |
SMD Pitch (a) | 0.2 mm (mil 8) |
BGA Pitch (b) | 0.2 mm (mil 8) |
Solder boju
Dam Solder Boju Dam (a) | 0.0635 mm (2.5mil) |
Imukuro boju-boju tita (b) | 0.1mm (4 mil) |
Min SMT paadi aaye (c) | 0.1mm (4 mil) |
Solder Boju Sisanra | 0.0007"(0.018mm) |
Iho
Iwọn Iho min (CNC) | 0.2 mm (mil 8) |
Min Punch Iho Iwon | 0.9 mm (35 mil) |
Iwon Iho TOL (+/-) | PTH: ± 0.075mm; NPTH: ± 0.05mm |
Iho Ipo TOL | ± 0.075mm |
Fifi sori
HASL | 2.5um |
asiwaju free HASL | 2.5um |
Immersion Gold | Nickel 3-7um Au:1-5u '' |
OSP | 0.2-0.5um |
Ìla
Ìla TOL (+/-) | CNC: ± 0.125mm, Punching: ± 0.15mm |
Beveling | 30°45° |
Gold ika igun | 15° 30° 45° 60° |
Iwe-ẹri | ROHS, ISO9001:2008, SGS, UL ijẹrisi |
A le ṣe fun ọ:
1-12 Layer FR4 PCB.
1-2Layer aluminiomu PCB.
1-4layer rọ PCB.
CEM-1 PCB
94VO PCB
SMT ati iṣẹ apejọ DIP.


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