Shenzhen oke didara aluminiomu PCB MCPCB pẹlu Taiyo PSR-4000 jara funfun solder boju


Apejuwe ọja

Agbara iṣelọpọ:

ohun kan Agbara iṣelọpọ
Ohun elo FR4, CEM-1, Aluminiomu, Poly amide
Layer No. 1-12
Pari ọkọ sisanra 0.1 mm-4.0mm
Ifarada Ọkọ Sisanra ± 10%
Cooper sisanra 0.5 OZ-3OZ (18 um-385 um)
Ejò Plating Iho 18-40 iwon
Impedance Iṣakoso ± 10%
Warp&Twist 0.70%
Peeli le 0.012"(0.3mm) -0.02'(0.5mm)

Awọn aworan

Iwọn Iwa Kakiri Min (a) 0.075mm (milionu 3)
Ìbú Ààyè Kekere (b) 0.1mm (4 mil)
Min Annuular Oruka 0.1mm (4 mil)
SMD Pitch (a) 0.2 mm (mil 8)
BGA Pitch (b) 0.2 mm (mil 8)

Solder boju

Dam Solder Boju Dam (a) 0.0635 mm (2.5mil)
Imukuro boju-boju tita (b) 0.1mm (4 mil)
Min SMT paadi aaye (c) 0.1mm (4 mil)
Solder Boju Sisanra 0.0007"(0.018mm)

Iho

Iwọn Iho min (CNC) 0.2 mm (mil 8)
Min Punch Iho Iwon 0.9 mm (35 mil)
Iwon Iho TOL (+/-) PTH: ± 0.075mm; NPTH: ± 0.05mm
Iho Ipo TOL ± 0.075mm

Fifi sori

HASL 2.5um
asiwaju free HASL 2.5um
Immersion Gold Nickel 3-7um Au:1-5u ''
OSP 0.2-0.5um

Ìla

Ìla TOL (+/-) CNC: ± 0.125mm, Punching: ± 0.15mm
Beveling 30°45°
Gold ika igun 15° 30° 45° 60°
Iwe-ẹri ROHS, ISO9001:2008, SGS, UL ijẹrisi

A le ṣe fun ọ:

1-12 Layer FR4 PCB.

1-2Layer aluminiomu PCB.

1-4layer rọ PCB.

CEM-1 PCB

94VO PCB

SMT ati iṣẹ apejọ DIP.

3
5

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