Gbona Sales HDI Multilayer FR4 PCB Circuit Boards Fun Micro SD Kaadi
Awọn alaye kiakia:
Sisanra Ejò:1 iwon
Ọkọ Sisanra: 1.0mm
Min.Iho Iwon: 0.20mm
Min.Iwọn ila: 0.075mm
Min.Laini Aye: 0.075mm
Ipari Ipari:ENIG
Iwọn igbimọ: Adani
Solder boju Awọ: Alawọ ewe Inki
Ifarada Sisanra igbimọ:+/- 10%
V-ge igun:25°,30°,45°,60°
Yiyi&Ipari:≤ 0.5%
Faili:Pro tel 99se/P-CAD/Afọwọṣe cad/Cam350
Iṣakojọpọ inu: Iṣakojọpọ igbale, apo ṣiṣu
Iṣakojọpọ ita: Iṣakojọpọ paali boṣewa
Iṣẹ: PCB & PCBA
Layer: 6 Layer
Boju-boju siliki: Funfun
Awọn ọja Apejuwe
| 1 | Apejuwe | PCB Spec |
| 2 | Ohun elo | FR-4/HTG150-180 FR-4/CEM-1/CEM-3/Aluminiomu |
| 3 | Layer | 1-20 |
| 4 | Ọkọ Sisanra | 0.2mm-4.0mm |
| 5 | Ifarada Ọkọ Sisanra | +/- 10% |
| 6 | Ejò sisanra | 17.5um-175um (0.5oz-5oz) |
| 7 | Min Wa kakiri Iwọn | 0.15mm |
| 8 | Iwọn Aye Min | 0.15mm |
| 9 | Min liluho Dia | 0.2mm |
| 10 | PTH Ejò sisanra | 0.4-2 mil (10-50um) |
| 11 | Ifarada ti Etching | ± 1 mil (± 25um) |
| 12 | V-ge igun | 25°,30°,45°,60° |
| 13 | Pearl Agbara ti ila | 6lb/ni(≥ 107g/mm) |
| 14 | Impedance Iṣakoso ati ifarada | 50Ω±10% |
| 15 | Lilọ&Ipari | ≤ 0.5% |
| 16 | Solder boju | Alawọ ewe, Pupa, Blue, Funfun, Dudu, Yellow |
| 17 | Dada Ipari / Plating | HASL/Lead Free HASL/OSP/Gold Plating/Immersion Gold/ENIG |
| 18 | Iwe-ẹri | ROSH.ISO9001 |
| 19 | Faili | Protel 99se / P-CAD / laifọwọyi cad / Cam350 |
| 20 | Iṣakojọpọ inu | Iṣakojọpọ igbale, apo ṣiṣu |
| 21 | Iṣakojọpọ lode | Standard paali packing |
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