Iboju Alawọ ewe Solder INK FR4 Gh60 8 Layer 94V0 Gold Plating Rigid PCB olupese

Apejuwe ọja

Nọmba ti Layer: 2-60 Layer

Ohun elo mimọ: Fr4, Fr-4, ALU, Roger, laisi idari

Ọkọ Sisanra: 0.2mm-3.5mm

Min.Iho Iwon: 0.1mm

Min.Iwọn Laini: 3mils

Min.Laini Aye: 3mils

Ipari dada: goolu immersion, OSP

Ọja orukọ: FR4 gh60 8 Layer 94vo goolu plating kosemi PCB olupese

iṣẹ: PCBA Board Service Afọwọkọ PCB Apejọ

dada finishing: Immersion goolu / tin / Au / fadaka / tin, OSP, HASL

Ohun elo: Electronics onibara

Solder boju awọ: Green White Red Blue Black

PCBA iru: Electronics Manufacturing ọkọ

Fẹlẹfẹlẹ: Awọn ipele 1-48 (pẹlu Rigid-Flex PCB)

PCB Fireproof: 94v0

Iwe-ẹri: ISO/ISO/ROHS/TS16949

Sisanra Ejò: 1-2oz

Jọwọ Pese: Aworan atọka, ile ikawe package (iwe data), eto DXF, awọn ibeere apẹrẹ.

Jọwọ Pese: Gerber faili ati be be lo.

Jọwọ Pese: Atokọ BOM pẹlu alaye nọmba Apakan ati Ipilẹṣẹ.

Awọn loke ti awọn faili PCB ati awọn akojọ BOM.

Nkan	Agbara deede	Agbara aropin	Nkan	Agbara deede	Agbara aropin
Layer No.	2-16	≤20	O pọju.sisanra bàbà(Pẹpẹ inu)	4OZ	5OZ
Mojuto ọkọ sisanra	0.075-2.0mm	0.05-3.0mm	O pọju.sisanra bàbà (Layer Layer)	4OZ	6OZ
min.PTH to Ejò	165.1um	152.4um	Min.aaye laarin awọn paadi SMD fun afara S/M	203.2um	177.8um
Isanra igbimọ (awọn ẹgbẹ meji)	0.3-3.2mm	0.3-4mm	Iwọn arosọ ti o kere ju / iga	127um / 762um	101.6um / 609.6um
Ọkọ sisanra(Opo-Layer)	0.6-3.2mm	0.6-4mm	Ifarada iwọn iwọn ila	± 101.6um	± 76.2um
Ifarada ti sisanra igbimọ (T≤0.8mm)	0.1mm	0.075mm	Teriba ati lilọ (T≤1mm)	≤0.75%	≤0.5%
Ifarada ti sisanra ọkọ(T = 0.8mm)	± 10%	± 5%	Teriba ati lilọ (T≤1mm)	≤0.5%	≤0.3%
Min.ila iwọn	76.2um	63.5um	konge iho to iho	± 0.05mm	/
Aaye laini to kere julọ	68.58um	63.5um	Iwọn iṣakoso impedance	± 10%	± 8%
Kere iho opin	0.2mm	0.15mm	Ipin ipin (0.2mm)	10:1	12:1
Ifarada ti tẹ fit Iho opin	0.05mm	0.05mm	Iwọn ọja ti pari	55-600mm	10-620mm
ọna profaili	CNC, V-CUT, Punching tabi m
Dada itọju	EING, OSP, fadaka immersion, OSP+ENIG ti o yan
Laminate iru	FR-4.0, FR-4.1 (TG deede, TG aarin, TG giga), CEM-3,