EMC Design Spark FR4 PCB Ati The tejede Circuit Board
Awọn alaye ọja
Ohun elo mimọ: FR4
Sisanra Ejò:1oz
Ọkọ Sisanra: 1.6mm
Min.Iho Iwon: 0.2mm
Min.Iwọn ila: 0.1mm
Min.Laini Aye: 0.1mm
Ipari Dada:HASL
Boju solder: Alawọ ewe
Silkscreen: Funfun
Idanwo PCB: Idanwo-idanwo, Idanwo Iwadii Flying
Idanwo PCBA: X-ray, Idanwo AOI, Idanwo iṣẹ ṣiṣe
Iwe-ẹri: UL.ROHS.CE
Iru awọn iṣẹ: Ṣiṣe PCB Didara to gaju
Awọn ọrọ-ọrọ: idiyele igbimọ PCB òfo
Iṣẹ: Iṣẹ-iduro kan
Layer: 1-24 fẹlẹfẹlẹ
Nkan | Sipesifikesonu | |
1 | Nọmba ti Layer | 1-18 Awọn ipele |
2 | Ohun elo | FR-4,FR2.Ta-conic,Rogers, CEM-1 CEM-3, seramiki, crockery Metal-backed Laminate |
3 | Dada Ipari | HASL(LF), Gold plating, Electrolysis nickel immersion goolu, Immersion Tin, OSP |
4 | Pari Board Sisanra | 0.2mm-6.00 mm(8mil-126mil) |
5 | Sisanra Ejò | 1/2 iwon min; 12 iwon max |
6 | Solder boju | Alawọ ewe/dudu/funfun/pupa/bulu/ofeefee |
7 | Min.Trace Width & Laini Aye | 0.075mm/0.1mm(3mili/4mil) |
8 | Min.Iho diamita fun CNC liluho | 0.1mm(4mil) |
9 | Min.Iho Diamita fun punching | 0.9mm(35mil) |
10 | Iwọn nronu ti o tobi julọ | 610mm * 508mm |
11 | Iho Ipo | +/- 0.075mm (3mil) CNC Liluho |
12 | Ìbú Adarí (W) | 0.05mm (2mil) tabi;+/- 20% ti iṣẹ ọna atilẹba |
13 | Opin Iho (H) | PTH L: +/- 0.075mm (3mil);KII-PTH L:+/- 0.05mm(2mil) |
14 | Ifarada Ifarada | 0.125mm (5mil) CNC Ipa ọna;+/- 0.15mm (6mil) nipa Punching |
15 | Warp & Yiyi | 0.70% |
16 | Idabobo Resistance | 10Kohm-20Mohm |
17 | Iwa ihuwasi | <50ohm |
18 | Igbeyewo Foliteji | 10-300V |
19 | Iwon nronu | 110×100mm(min);660×600mm(o pọju) |
20 | Layer-Layer minisita | 4 fẹlẹfẹlẹ: 0.15mm (6mil) o pọju;6 fẹlẹfẹlẹ: 0.25mm (10mil) max |
21 | Min.spacing laarin iho eti to circuity Àpẹẹrẹ ti ohun akojọpọ Layer | 0.25mm(10mil) |
22 | Min.spacing laarin awọn ilana ilana circuitry ọkọ ti ohun akojọpọ Layer | 0.25mm(10mil) |
23 | Board sisanra ifarada | 4 fẹlẹfẹlẹ: +/- 0.13mm (5mil);6 fẹlẹfẹlẹ:+/-0.15mm(6mil) |
24 | Impedance Iṣakoso | +/- 10% |
25 | Iyatọ ti o yatọ | +-/10% |