EMC Design Spark FR4 PCB Ati The tejede Circuit Board


Apejuwe ọja

Awọn alaye ọja

Ohun elo mimọ: FR4

Sisanra Ejò:1oz

Ọkọ Sisanra: 1.6mm

Min.Iho Iwon: 0.2mm

Min.Iwọn ila: 0.1mm

Min.Laini Aye: 0.1mm

Ipari Dada:HASL

Boju solder: Alawọ ewe

Silkscreen: Funfun

Idanwo PCB: Idanwo-idanwo, Idanwo Iwadii Flying

Idanwo PCBA: X-ray, Idanwo AOI, Idanwo iṣẹ ṣiṣe

Iwe-ẹri: UL.ROHS.CE

Iru awọn iṣẹ: Ṣiṣe PCB Didara to gaju

Awọn ọrọ-ọrọ: idiyele igbimọ PCB òfo

Iṣẹ: Iṣẹ-iduro kan

Layer: 1-24 fẹlẹfẹlẹ

Nkan

Sipesifikesonu

 

1

Nọmba ti Layer

1-18 Awọn ipele

2

Ohun elo

FR-4,FR2.Ta-conic,Rogers, CEM-1 CEM-3, seramiki, crockery Metal-backed Laminate
3

Dada Ipari

HASL(LF), Gold plating, Electrolysis nickel immersion goolu, Immersion Tin, OSP

4

Pari Board Sisanra

0.2mm-6.00 mm(8mil-126mil)

5

Sisanra Ejò

1/2 iwon min; 12 iwon max

6

Solder boju

Alawọ ewe/dudu/funfun/pupa/bulu/ofeefee

7

Min.Trace Width & Laini Aye

0.075mm/0.1mm(3mili/4mil)

8

Min.Iho diamita fun CNC liluho

0.1mm(4mil)

9

Min.Iho Diamita fun punching

0.9mm(35mil)

10

Iwọn nronu ti o tobi julọ

610mm * 508mm

11

Iho Ipo

+/- 0.075mm (3mil) CNC Liluho

12

Ìbú Adarí (W)

0.05mm (2mil) tabi;+/- 20% ti iṣẹ ọna atilẹba

13

Opin Iho (H)

PTH L: +/- 0.075mm (3mil);KII-PTH L:+/- 0.05mm(2mil)

14

Ifarada Ifarada

0.125mm (5mil) CNC Ipa ọna;+/- 0.15mm (6mil) nipa Punching

15

Warp & Yiyi

0.70%

16

Idabobo Resistance

10Kohm-20Mohm

17

Iwa ihuwasi

<50ohm

18

Igbeyewo Foliteji

10-300V

19

Iwon nronu

110×100mm(min);660×600mm(o pọju)

20

Layer-Layer minisita

4 fẹlẹfẹlẹ: 0.15mm (6mil) o pọju;6 fẹlẹfẹlẹ: 0.25mm (10mil) max

21

Min.spacing laarin iho eti to circuity Àpẹẹrẹ ti ohun akojọpọ Layer

0.25mm(10mil)

22

Min.spacing laarin awọn ilana ilana circuitry ọkọ ti ohun akojọpọ Layer

0.25mm(10mil)

23

Board sisanra ifarada

4 fẹlẹfẹlẹ: +/- 0.13mm (5mil);6 fẹlẹfẹlẹ:+/-0.15mm(6mil)

24

Impedance Iṣakoso

+/- 10%

25

Iyatọ ti o yatọ

+-/10%
5
6

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