Ona igbona taara MCPCB ati Sink-pad MCPCB, Copper Core PCB, Ejò PCB
Awọn alaye ọja
Ohun elo mimọ: Alu/ bàbà
Sisanra Ejò:0.5/1/2/3/4 OZ
Ọkọ Sisanra: 0.6-5mm
Min.Opin Iho: T/2mm
Min.Iwọn ila: 0.15mm
Min.Laini Aye: 0.15mm
Ipari Ilẹ: HASL, goolu immersion, goolu filaṣi, fadaka ti a fi palara, OSP
Orukọ ohun kan: PCB LED PCB ti a tẹjade, PCB Aluminiomu, mojuto Ejò
PCB
V-ge Igun:30°,45°,60°
Ifarada apẹrẹ: +/- 0.1mm
Iho DIA ifarada: +/- 0.1mm
Imudara Ooru: 0.8-3 W/MK
E-igbeyewo foliteji: 50-250V
Peeli-pa agbara:2.2N/mm
Yiyọ tabi lilọ:
PTH Odi sisanra:> 0.025mm
| Rara. | Awọn nkan | Atọka |
| 1 | dada Itoju | HASL, goolu immersion, goolu filaṣi, fadaka palara, OSP |
| 2 | Layer | Nikan-ẹgbẹ |
| 3 | PCB sisanra | 0.6-5mm |
| 4 | Ejò bankanje Arun | 0.5-4 iwon |
| 5 | Min Iho opin | T/2mm |
| 6 | Min Line iwọn | 0.15mm |
| 7 | Fẹlẹfẹlẹ | 1-4 fẹlẹfẹlẹ |
| 8 | Iwọn igbimọ ti o pọju | 585mm * 1185mm |
| 9 | Min ọkọ iwọn | 3mm*10mm |
| 10 | Ọkọ sisanra | 0.4-6.0mm |
| 11 | Aaye min | 0.127mm |
| 12 | PTH sisanra ogiri | > 0.025mm |
| 13 | V-gige | 30/45/60 iwọn |
| 14 | V-ge iwọn | 5mm * 1200mm |
| 15 | Min.bag paadi | 0.35mm |
Ìfilọ: MCPCB apa kanṣoṣo, MCPCB apa meji, MCPCB ilọpo meji, MCPCB bendable, MCPCB ti o gbona taara, eutectic bonding flip -chip MCPCB.MCPCB wa ni adani.
1.aluminiomu mimọ PCB LED ina ti o ni imọlẹ ina ti o ni imọlẹ ina
2.aluminiomu sobusitireti PCB
3.aluminiomu mimọ Ejò-agbada laminate PCB
4.aluminiomu mimọ PCB
1) ohun elo: FR-4, Ejò, Aluminiomu orisun
2) Layer: 1-4
3) sisanra Ejò: 0.5oz, 1.0oz, 2oz, 3oz, 4oz
4) Ipari oju: HASL, OSP, Immersion Gold, Immersion fadaka, Filaṣi goolu, Fadaka Palara.
5) awọ boju solder: alawọ ewe, dudu, funfun.
6) V-ge igun: 30, 45,60 ìyí
7) E-igbeyewo foliteji: 50-250V
8) Iwe-ẹri: UL, ISO9001, ROHS, SGS, CE
MC PCB Imọ Agbara
| ;Iru | Nkan | Agbara | Iru | Nkan | Agbara |
| Fẹlẹfẹlẹ | / | 1-4 | Iho iwọn | Liluho iho iwọn | 0.6-6.0mm |
| Laminate | Laminate iru | Aluminiomu, irin, ati ipilẹ ipinya Ejò | Iho ifarada | ± 0.05mm | |
| Iwọn | 1000 * 1200mm 60081500mm | Ifarada ti iho ipo | ± 0.1mm | ||
| Ọkọ sisanra | 0.4mm-3.0mm | Ipin ipin | 5:1 | ||
| Ifarada ti sisanra ọkọ | ± 0.1mm | Solder boju | Min solder Afara | 4mil | |
| Dielectric sisanra | 0.075-0.15mm | Ipalara | Ifarada impedance | ± 10% | |
| Circuit | Min iwọn / aaye | 5 milionu / 5 milionu | Peeli agbara | ≥1.8 N/mm | |
| Ifarada ti iwọn/ aaye | ± 15% | Dada resistance | ≥1*105M | ||
| Ejò sisanra | Ti abẹnu ati ti ita | 0,5-10 iwon | ≥1*106M | ||
| resistrivity iwọn didun | |||||
| Gbona elekitiriki | Kekere ooru elekitiriki 1.0-1.5 | ||||
| Aarin ooru elekitiriki 1.5-1.8 | |||||
| Ga elekitiriki 2.0-8.0 | |||||
| Solder fioat | 260℃, 10mil, Ko si roro, Ko si ipinnu | ||||
| Igbanilaaye | ≤4.4 | ||||
