Agbara

Awọn agbara FR4:

Nkan Imọ ni pato
Ohun elo Iru FR-1, FR-4, CEM-1, CEM-3, Rogers, ISOLA
Sisanra ohun elo 0.062”, 0.080”, 0.093”, 0.125”, 0.220”, 0.047”, 0.031”, 0.020”, 0.005”
Iwọn Layer 1 to 20 Layer
O pọju.Board Iwon 22.00" x 28.00"
IPC Kilasi Kilasi II, Kilasi III
Oruka Annular 5 mil/ẹgbẹ tabi Nla (Min. Apẹrẹ)
Pari Plating Solder(HASL), Solder Free Lead (L/F HASL), ENIG (Electroless Nickel Immersion Gold), OSP, Fadaka Immersion, Tin Immersion, Immersion Nickel, Hard Gold, etc.
Òwú Ejò Lode: Titi di 7oz, Inu: to 4 iwon.
Wa kakiri/Iwọn Aye 3/3 mil
Iwọn paadi ti o kere julọ 12 mil
Palara Iho 0.016"
Iho kere 8 mil;4 mil
Awọn ika ọwọ goolu 1 si 4 Edge (30 si 50 Micron Gold)
SMD ipolowo 0.080" - 0.020" - 0.010"
Soldermask Iru LPI didan, LPI-Matte
Soldermask Awọ Alawọ ewe, Pupa, Blue, Dudu, Funfun, Yellow, Ko o
Àlàyé Awọ Funfun, Yellow, Dudu, Pupa, Blue.
Iwọn Ọna ti o kere julọ 0.031”
Ifimaaki (v-cut) Awọn laini ti o tọ, Ifimaaki fo, CNC V-CUT.
Wura Lile, asọ, IMMERSION (to 50 wura MICRON)
Data File kika Gerber RS-274x pẹlu iho embedder.
Fab.Iyaworan kika Awọn faili Gerber, DXF, DWG, PDF
Ipin ipin 10:01
Counter ifọwọ / Counter Bore Bẹẹni
Imudaniloju Iṣakoso Bẹẹni
Afọju Vias / sin Vias Bẹẹni
Boju ti o le peelable Bẹẹni
Erogba Bẹẹni

Awọn agbara MC PCB:

Nkan Imọ ni pato
Nọmba ti fẹlẹfẹlẹ Ẹka ẹyọkan, Awọn ẹgbẹ meji, Awọn fẹlẹfẹlẹ mẹrin MCPCB
Iru ọja Aluminiomu, Ejò, Iron mimọ MCPCB
Olupese ti laminate Berquist, Ventec, Polytronics, Boyu, Wazam ati bẹbẹ lọ.
Pari sisanra ọkọ 0.2 ~ 5.0mm
Ejò sisanra Hoz-3oz
Olupese boju solder Taiyo, Fotochem ati bẹbẹ lọ.
Awọ ti solder boju Funfun, Dudu, Pupa, Blue, Yellow etc.
Ipari dada L/F HASL, OSP, ENIG, Electrolytic Silver, Immersion Tin, Immersion Silver ati be be lo.
Iru ilana ti pari Ipa ọna, Punching, V-ge
Teriba ati lilọ ≤0.75%
Min iho ká iwọn 1.0mm
O pọju.ọkọ iwọn 1500mmX610mm
Min.ọkọ iwọn 10mmX10mm