4 Layer PCB Manufacturing Prototype Poku Price PCB olupese i China
Awọn alaye ọja
Ohun elo: Itanna, ologun, oogun, ati be be lo
Iwe-ẹri:ISO/TS16949/ROHS/TS16949
Solder boju awọ: Alawọ ewe Black Blue White
Nọmba ti Layer: 1-22 Layer
Iṣẹ: Onimọ-ẹrọ ọjọgbọn, o dara lẹhin iṣẹ, idiyele ifigagbaga
PCB Standard: IPC-A-610 D/IPC-III Standard
Ifarada Iho: PTH: ± 2mil, NTPH: ± 2mil
Ifarada Ọkọ Sisanra: ± 10%
| Awọn iṣẹ OEM/ODM: | |||
| Fẹlẹfẹlẹ | 1-22 fẹlẹfẹlẹ | Min.ila iwọn | 2 mil |
| Max.board iwọn (nikan & ilopoapa) | 700 * 1200mm | Min.annular oruka iwọn: fisa | 3 mil |
| Ipari dada | HAL (pẹlu Pb ọfẹ), ti a palara Ni/Au,fadaka immersion,IMM Ni/Au,I MM Sn,wura lile, OSP, ati be be lo | Isanra Min.board(multilayer) | 4 fẹlẹfẹlẹ: 0.4mm;6 fẹlẹfẹlẹ: 0.6mm;8 fẹlẹfẹlẹ: 1mm; 10 Layer: 1.2mm |
| Awọn ohun elo igbimọ | FR-4;giga TG;CTI ti o ga;halogen free;igbohunsafẹfẹ giga (rogers, ta-conic,PTFE,nelson,ISOLA, polyclinic 370 HR;nipọn Ejò | Sisanra fifi sori (Ọna:Immersion Ni/Au) | Iru fifi sori: IMM Ni, Min./Max sisanra:100/150U"Iru fifi sori: IMM Au, Min./Max sisanra:2/4U" |
| Iṣakoso impedance | ± 10% | Ijinna laarinila to ọkọ eti | Apejuwe: 0.2mm V-CUT: 0.4mm |
| sisanra Ejò mimọ (Inuati Layer ita) | Min.sisanra: 1/3 OZ Max.sisanra: 6OZ | Iwọn Min.hole (sisanra igbimọ ≥2mm) | Ipin ipin≤16 |
| Pari Ejò sisanra | Awọn ipele ita:Isanra 1 OZ,Max.sisanra 10 OZ Awọn ipele inu: Isanra 0.5OZ, Max.sisanra 6 OZ | Isanra ti o pọju (ẹyọkan&apa meji) | 6mm |
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